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Please contact ROKKO at
Attention: Overseas Sales Dept.
TEL: 81-798-65-4508
FAX: 81-798-67-5038
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Job Opportunities
Please click below
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ROKKO ELECTRONICS Co., Ltd.
Zipp: 663-8105
8-5, Nakajima-cho, Nishinomiya-city, Hyogo, Japan
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■ Processing compatibility
chart by material
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○-Mark = Processable Each material＊Each processing content
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Processing details
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Material
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Face
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Bevel processing
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Temporary bonding
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Grinding
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Film removal etching
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Polishing
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Double side polishing
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CMP
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RCA
claening
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Reclaim
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gas cluster beam
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Frame mount
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Silicon
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○
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○
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○
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○
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○
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○
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○
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○
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○
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○
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N-dope SiC
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Si-face
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○
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○
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○
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○
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○
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○
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○
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○
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C-face
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○
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○
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○
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○
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○
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○
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○
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○
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Semi-insulating
SiC
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Si-face
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○
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○
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○
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○
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○
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○
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○
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○
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C-face
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○
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○
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○
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○
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○
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○
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○
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○
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Polycrystalline
SiC
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○
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○
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○
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○
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○
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LiTaO 3
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○
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○
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○
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○
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○
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○
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LiNbO3
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○
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○
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○
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○
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○
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○
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GaN
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Ga-face
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○
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○
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○
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○
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○
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N-face
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○
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○
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○
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○
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○
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Sapphire
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○
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○
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○
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○
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○
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○
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○
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Ga2O3
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○
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○
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○
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○
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AlN
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○
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○
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Quartz
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○
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○
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○
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○
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○
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○
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GaN on Si
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○
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○
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○
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○
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○
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○
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GaN on Sap
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○
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○
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○
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○
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○
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○
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GaN on SiC
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○
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○
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○
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○
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○
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○
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SOI
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○
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○
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○
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○
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○
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○
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○
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Oxide film
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○
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○
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○
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Glass
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○
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○
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○
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○
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○
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○
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2inchGaN-250um CMPfinish
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CMPfinish 2inchGaN-250um
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ウェハ
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A
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B
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C
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D
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E
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TV5
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AVE.
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um
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250.4
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250.4
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249.6
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250.7
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250.2
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1.1
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250.3
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ZygoMeasurement data
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No.
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Sa (Surface Roughness) Unit: nm
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outer
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middle
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center
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average
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1
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0.097
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0.188
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0.194
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0.160
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6inchSAP-250um CMPfinish
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CMPfinish 6inchSAP-250um Unit：um
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Wafer
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A
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B
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C
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D
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E
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TV5
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AVE.
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1
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250.2
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249.8
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250.8
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250.1
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249.6
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1.2
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250.1
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2
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249.1
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248.2
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249.5
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249.7
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248.5
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1.5
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249.0
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3
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250.5
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250.1
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248.8
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250.3
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249.8
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1.7
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249.9
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ZygoMeasurement data
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No.
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Sa (Surface
Roughness) Unit: nm
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outer
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middle
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center
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average
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1
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6.23
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6.01
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5.20
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5.81
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2
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4.60
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5.30
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5.81
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5.24
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3
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6.21
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6.07
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5.35
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5.88
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6inch-GaNonSiC(glass resin bonding) CMPfinish
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CMPfinish 6inch-GaNonSiC(glass resin
bonding) Unit：um
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ウェハ
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A
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B
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C
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D
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E
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TV5
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AVE.
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1
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50.5
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50.2
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50.1
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48.4
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49.3
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2.1
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49.7
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2
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50.1
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49.1
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50.3
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50.6
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50.8
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1.7
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50.2
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3
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49.6
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49.8
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50.1
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51.6
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50.8
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2.0
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50.4
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ZygoMeasurement data
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No.
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Sa (Surface
Roughness) Unit: nm
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outer
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middle
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center
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average
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1
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0.094
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0.094
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0.098
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0.095
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2
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0.091
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0.094
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0.096
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0.094
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3
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0.091
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0.098
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0.097
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0.095
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