rokko electronics co., ltd.


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TEL: 81-798-65-4508
FAX: 81-798-67-5038

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knife edge prevention process

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for pattern wafer RCA cleaning

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平成24年度西宮市優良事業所顕彰受賞


ROKKO ELECTRONICS Co., Ltd.

Zipp: 663-8105
8-5, Nakajima-cho, Nishinomiya-city, Hyogo, Japan



加盟団体

SIIQ

NEDIA

SiCアライアンス

SiC及び関連ワイドギャップ半導体研究会

パワーデバイス・イネーブリング協会

SSL GlobalSign Site Seal


▼ Services

Rokko takes the following roles in the semiconductor production process.

- Wafer surface and backside sophisticate grinding and polishing
- Monitor wafer reclaiming
- Chemical processing and RCA cleaning to control metal contaminations and particles in reclaim wafer process.
- Special wafer processing for MEMS applications

■ Main process services

 

Backside grinding

Backside polishing

Backside grinding & Polishing
■4-8 inch
■Bumped wafer
■Pressure sensor mounted or UV taped wafer
■Ring-framed wafers

■4-8 inch
■Batch/Single system polishing equipment
■Single/Double side mirror finish
■RCA cleaning


■4-8 inch
■Batch/Single system polishing equipment
■Single/Double side mirror finish
■GWSS
 
 

Reclaim polishing
 

MEMS wafer processing
     
■4-6 inch
■Film stripping
■RCA cleaning
■Particle・Metal contamination・Thickness・Appearance inspection

■4-8 inch
■BG&POL
■SOI wafer each layer thickness control
■GWSS
■Cavity structured wafer・Through-silicon via wafer
■Half cut dicing wafer

 
 


■ Introduction and description of the used equipment in each process
UV irradiator
  Fully Automated Grinding machine

UV irradiator
Remove the UV tape (Also includes a dicing ring)

Fully Automated Grinding machine
Capable of a single wafer and multiple wafer productions.

  Dual steam cleaning tool




Dual steam cleaning tool
This single tool provides DIW cleaning, rinsing and air drying to wafers up to 8 inch diameter.


Monitor wafer reclaiming

This is recycling services enables monitor wafers used in the semiconductor process to be used again by refining their conditions to the original quality.
Through the services, monitor wafers can be used repeatedly to reduce material costs.
Wafer size:
3 inch
4 inch
5 inch
6 inch
Film stripping
reclaim
Selected recipe
reclaim  
Incoming inspection
reclaim
Polishing

Classify thickness and film type
 
 
reclaim
Shipping
reclaim
Final inspection
reclaim
Cleaning
 
Particle,Metal contamination,Thickness
 
RCA cleaning

Film stripping   Batch system polishing machine

Film stripping
Various films on wafers are removed by chemical etching.

Batch system polishing machine
Performs multiple wafer mirror-polishing.
Single wafer polishing machine
  RCA cleaning equipment

Single wafer polishing machine
A single wafer type polisher

RCA cleaning equipment
Wafers are cleaned to remove particles and metal contaminations.


■ Company Aspect

Rokko always appreciates any inquiries and orders of any size.

Rokko has the established sophisticate polishing and grinding technique to process front/back surface with high accuracy through its integrated process in order to deliver the finished products to time to meet customer’s needs. This experience allows the company to meet diverse demands of grinding and polishing required by MEMS or other related applications. Rokko always appreciates any inquiries and orders of any size.

■ Processing services
Integrated grinding and polishing services ● Integrated grinding and polishing services

Integrated grinding and polishing services
Rokko provides the thin / mirror finished surface required for sensor or power device appreciations through its integrated grinding and polishing process. 4 to 8 inch wafers can be processed with the finished thickness of 15 to 100um in both test and volume productions. Besides the integrated processing services, Rokko is also capable of meeting special processing needs such as grinding-finish (#8000~) and polishing-only services.
Monitor wafer reclaiming services ● Monitor wafer reclaiming services

Rokko provides wafer reclaiming services that allow the company to perfectly comply with customer’s specifications of thickness, particles and metal contaminations. 4 to 6 inch wafers are reclaimable in this service.
MEMS Process ● MEMS Process

Rokko’s experience in this field enables to meet the diverse needs in MEMS applications through its special grinding and polishing technique. This service can be applied from a single wafer production to large volume or prototyping to mass productions. Rokko is well experienced in grinding and polishing SOI・glass/Si mounted, through-holed, cavity structured, through-silicon via (TSV) and non-circular wafers.

■ Process Quality
All services are performed under the clean controlled environment. Rokko is obtained Environment Management System (ISO14000) and Quality Management System (ISO9001) certifications to comply with the international standards/
Pursuit of Quality ● Pursuit of Quality

Quality is the 1st priority in Rokko’s operations. All parameters are measured and monitored, which includes thickness accuracy, polishing precision to give customers the best available quality and services.


▼ Inspection Equipment

Rokko is making continuous efforts to develop new technologies in not only Si wafer but also sapphire and SiC process through our cultivated experiences in grinding, polishing and cleaning fields. We believe customer satisfaction is the base of our technology development and our success cannt be achieved without the support from our customers. Based on this standard, we will make further efforts to ensure the satisfaction by introducing cutting edge equipment and technologies.

● Automatic spectral interference wafer thickness meter

Automatic spectral interference wafer thickness meter
Thickness can be measured for the silicon layer only of the taped wafer・SOI・supported wafer・resin-material/tape supported wafer(in case 2 silicon wafers are attached, one side silicon layer can be measured).
● Automatic spectral interference wafer thickness meter

Automatic spectral interference wafer thickness meter
Thickness can be measured for supporting silicon layer only or active layer only, other than the total thickness measurement of wafer, for the thinned MEMS/Sensor wafer.

New equipment:Wafer sorter for resistivity・P/N・thickness
● Wafer sorter for resistivity・P/N・thickness

Wafer sorter for resistivity・P/N・thickness
For 4,5,6,8 inch
● Wafer sorter for resistivity・P/N・thickness

Wafer sorter for resistivity・P/N・thickness
Measurable resistivity:1.0m~3.0MΩ・cm

Candela CS20 Wafer surface inspection machine

  Candela CS20 Wafer surface inspection machine

Candela CS20 Wafer surface inspection machine
This is used for transparent substrates to inspect various defects, dirt, pits on Epi layers, hatching and crystal damages.

Candela CS20 Wafer surface inspection machine
Wafer Size: 3, 4, 5, and 6 Inch
Measurable thickness: 300-1400um
Capacitance wafer thickness measuring equpment TME-07
  Capacitance wafer thickness measuring equpment TME-07

Capacitance wafer thickness measuring equpment
This equipment unloads wafers from cassettes and measures thickness at a designated coordinate of wafer. The measurement is done by a contactless capacitance sensor.

Capacitance wafer thickness measuring equpment
Measurable thickness: 100-1800um (depends on wafer sizes)
Center point measurement (Coordinates can be set through the machine configuration)
Total reflection x-ray fluorescence analysis tool TREX610   Differential interference contrast microscope

Total reflection x-ray fluorescence analysis tool
Measurable elements: 12 elements (S, Cl, K, Ca, Ti, Cr,Mn,Fe,Co,Ni,Cu,Zn)

Differential interference contrast microscope
This tool allows to observe roughness on a wafer surface.
Wafer surface laser inspection tool TOPCON WM7   Wafer surface laser inspection tool TOPCON WM3

Wafer surface laser inspection tool
Detection limit: 7um
Unit: Long-life Violet LD laser type
Wafer Size: 4, 5 and 6 Inch
Ranges:0.087μ~5.0μ

Wafer surface laser inspection tool
Wafer Size: 4, 5 and 6 Inch
Rages:0.208μ~1.0μ
Wafer surface laser inspection tool LS6030   Visual inspection

Wafer surface laser inspection tool
Wafer Size: 5, 6, 8 Inch
Ranges:0.1μ~5.0μ

Visual inspection
Wafers are inspected under a halogen lamp in a dark room.



▼ MEMS・Prototype

Rokko’s experience in this field enables the company to meet the diverse needs in MEMS applications through its special grinding and polishing technique. This service can be applied from a single wafer prototyping to mass productions. Rokko is well experienced in grinding and polishing SOI・glass/Si mounted, through-holed, cavity structured, through-silicon via (TSV) and non-circular wafers.

■ Expamples of MEMS products


● Thinned Wafer

Diameter: φ200mm
Thickness: 32μm
BG:#2000 Finish

Thinned Wafer

● GWSS(Glass Wafer Support System)

Diameter: φ200mm
Thickness: 11μm
BG:#2000 Finish
Glass: Pyrex

GWSS(Glass Wafer Support System)

● GWSS(Glass Wafer Support System)

Diameter: φ200mm
Thickness: 4.5μm
BG:#2000 Finish
Glass: Pyrex


Backggrinding & Polish
8 inch Silicon
TV5 (um)
Range
A
B
C
D
E
4.15
4.6
4.37
2.21
3.93
2.39
GWSS(Glass Wafer Support System).

GWSS(Glass Wafer Support System)
GWSS(Glass Wafer Support System)

● Cavity structured wafer

Diameter: φ150mm
Thickness: 100μm
BG:#2000 Finish


Cavity structured wafer

● Cavity structured wafer

The above wafer was thinned by 5um.

Cavity structured wafer

 Back grinding and polishing for TSV

“Points to be aware in TSV Processing”

1) Surface sag around the hole Area around the hole may sag due to the action of the chemical, depending on the polishing time.
2) Edge damage During TSV process, DREI is used, so you may see fine edge erosion.
3) Foreign matter in the hole Fine polishing particles may remain in the holes.

  ROKKO Electronics will address all of these points of concern


Points to be aware in TSV Processing
 Half cut dicing

Half cut by dicing super thinning wafer is chipped by Back grinding.

Half cut dicing
 Knife Edge preventive process

『Customer needs』
● How do you prevent wafers from being broken or chipped after wafer thing process? These damages are mainly caused by either human handling or equipment conveyance and it dose affects your process yield. How do you want to solve this problem?

Rokko provides pre-grinding beveling services meeting the diversified requirements of finished thickness (ex. 100 um or 50um).

Through the NC control beveling, Rokko is capable of processing wafers with various thickness without changing polishing pads.

Before BG
Beveling
After BG
Knife Edge preventive process Knife Edge preventive process
Knife Edge preventive process
※Non-beveling process ※Forming a knife edged shape
Knife Edge preventive process Knife Edge preventive process Knife Edge preventive process
※Beveling process ※Beveling compatible with various wafer thickness to form a proper edge profile

Crick here for the video clip showing a dropping test result of 6 inch wafers “with” and “without beveling” →
YOUTUBE
● Knife edge preventing process unit

Knife edege proventing process unit
Wafer size: 4, 5, 6, 8 Inch
● Knife edge preventing process unit

Knife edege proventing process unit
Through NC control system, shapes of edge can be adjusted according to its thickness.
 Back Grinding

Rokko has over 10 years of experiences in the wafer thinning business with various types of wafers from SOI・glass/Si mounted to normal mass production wafers (100-150um thickness).
We are making our continuous efforts to improve the yields of wafers received from our customers.
MEMS applications: SOI・glass/Si mounted, through-holed, cavity structured, through-silicon via (TSV) and non-circular wafers
● Backside Grinder

backside grinder
Wafer Size: 4, 5, 6, 8 Inch
● Backside Grinder

backside grinder
Achieving higher yields through daily maintenance checks.

New Functions:
In the conventional process, wafer thickness is measured by an in-process gauge. Rokko has just installed the machine equipped with NCG (non-contact type gauge) which allows the machine to measure wafer thickness by laser without touching. In the newly developed process, all wafers including MEMS such as cavity structured, holed wafers can be measured.

NCG (non-contact type gauge)
■Wafer Size:5・6・8inch
■Thickness: 100~150μm
■MEMS Wafer process

Rokko is well experienced in processing various kinds of wafers such as SOI・glass/Si mounted, through-holed, cavity structured, through-silicon via (TSV) and non-circular wafers.


 Single wafer backside polishing

In this process, wafers are mirror-polished by removing small roughness on a wafer surface. This process requires highly sophisticated polishing techniques to avoid any distortions or scratches on wafer surfaces.

■Merits of Single wafer process:
●It is a wax-less process that allows to achieve higher cleanness levels by reducing cleaning requirements.
●A single wafer process equipment can polish wafers more efficiently than the batch type and it also requires less removals in comparison.
●A single wafer process provides more accurate polishing and it also helps to achieve higher flatness levels.
● Single wafer backside polishing equipment

Single wafer type backside polishing
Wafer Size: 4, 5, 6, 8 Inch
● Single wafer backside polishing equipment

Single wafer type backside polishing
This machine is capable of processing thinned wafers and MEMS wafers.

New equipment:8 inch single wafer polishing machine
■Wafer Size:4・5・6・8inch
■Best thinning achievement:8inch 85μm
● Backside polishing equipment for 8-inch

Backside polishing equipment for 8-inch
Wafer Size:4・5・6・8inch
● Backside polishing equipment for 8-inch

Backside polishing equipment for 8-inch
Best thinning achievement:8inch 85μm
 Automatic scrub cleaning process

New Equipment:
After polishing, residues contain alkaline substances results in becoming polishing marks or sources of particle. Removing such residues before coated by native oxide films is one of the key techniques in polishing.
In our conventional process, wafers are cleaned piece by piece through operator’s manual scrubbing. Now, Rokko introduced the automated cleaning equipment to eliminate human errors and deviation of quality to achieve the uniform stable quality.

■Wafer Size:4・5・6・8 inch
■Thickness: ~ 100μm
■Patterned・ M EMS and SOIWafer
Glass supported wafers also can be processed.
● Automatic scrub cleaning process

Automatic scurub cleaning process
High cleaning performance.
● Automatic scrub cleaning process

Automatic scurub cleaning process
Wafer Size:4・5・6・8 inch
Sapphire and SiC wafers can be processed
 Processed surface contactless tape peeling

Protective tapes are peeled off from wafers without touching processed surfaces.
■Wafer Size: 5, 6 Inch
■Tape Type:UV tapes
■Characteristics:
●By Bernoulli chucking robotic arms, wafers are conveyed without being touched.
●After wafers are set on the stage for UV irradiation process, through this procedure, protective tapes on wafers are removed automatically.
● Processed surface contactless tape peeling unit

Processed surface contactless tape peeling process
Wafer Size: 5, 6 Inch
● Processed surface contactless tape peeling unit

Processed surface contactless tape peeling process
Post-polishing surfaces are very fragile. Micro-scratches can be caused easily if the surface is touched by any metallic equipment parts. This unit is capable of removing tapes without touching wafer surfaces.
 RCA cleaning process for patterned wafers

■Available services
・RCA cleaning for wafers with metallic patterns (particle and metal contamination cleaning)
・RCA cleaning for filmed wafers (particle and metal contaminations cleaning)
・Wafer backside RCA cleaning for handle wafers or bonded wafers. (particle and metal contamination cleaning)

■Basic specifications
・Polished surface contactless automated conveyance (cassettes to cassettes) ・Simultaneous double chambered spinning method (RCA cleaning ⇒DIW rinsing⇒Drying)
・Cleaning metal contaminations by only one chemical treatment.
・4, 5, 6 and 8 inches can be processed with minimum thickness of 150um. (The process for under 150um is under development.)
・Handle wafers can be processed in Rokko.

■Cleanness (Patterned wafer backside)
Particles: ≧0.3um,≦50pcs/wf
Heavy metals:≦5.0E10atoms/㎝-2
(Ka,Ca,Ti,Cr,Mn,Fe,Co,Ni,Cu,Zn,Al,Na)


Click here for a demonstration of wafer backside RCA cleaning of patterned wafers→
YOUTUBE
● RCA cleaning process for patterned wafers

RCA cleaning process for patterned wafers
Wafer Size: 4, 5, 6, 8 Inch
● RCA cleaning process for patterned wafers

RCA cleaning process for patterned wafers
This equipment is capable of cleaning only onside (backside) without causing any damages on the other side.

■ Tools and Equipment
Fully automated grinding machine
  Single wafer system thin film polishing machine

Fully automated giriding machine
Capable of a single-wafer and multiple-wafer processes.

Single wafer system thin film polishing machine
Polishes wafers with high accuracy without contacting polishing surface. This machine is solely developed and customized by Rokko.
Capacitance wafer thickness measuring equipment
  Capacitance wafer thickness measuring equipment

Capacitance wafer thickness measuring equpment
This equipment unloads wafers from cassettes and measures thickness at a designated coordinate of wafer. The measurement is done by a contactless capacitance sensor.

Capacitance wafer thickness measuring equpment
Measurable thickness: 100-1800um (depends on wafer sizes)
Center point measurement (Coordinates can be set through the machine configuration)

● Automatic spectral interference wafer thickness meter

Automatic spectral interference wafer thickness meter
Thickness can be measured for the silicon layer only of the taped wafer・SOI・supported wafer・resin-material/tape supported wafer(in case 2 silicon wafers are attached, one side silicon layer can be measured).
● Automatic spectral interference wafer thickness meter

Automatic spectral interference wafer thickness meter
Thickness can be measured for supporting silicon layer only or active layer only, other than the total thickness measurement of wafer, for the thinned MEMS/Sensor wafer.


▼ Power Devices


Unlike other types of semiconductor devices, power devices are used in high voltage applications. So, the deivices is made from a high tension proof silicon with high thermostability. The high tension proof silicon is formed by growing an epitaxial layer over silicon substrate and the substrate is thinned to improve its heat radiation performance. Rokko plays an important role in the wafer thinning process though its backside grinding services. The company has well developed technologies and process recipes to guarantee original quality of customer products during and after grinding. For instance, Rokko is able to use a special grinding wheel that stimulates growth of a gettering layer on grinded surface.


In a power device, an electric current flows in vertical direction (top to bottom). Because of its characteristics, a power device has electric poles on its backside to have a stream of electric current on front. The backside poles are formed through a metal deposition. In the deposition, a metal layer must grow uniformly or the bonding surface will start to come off (Air penetration causes temperature deviation). Therefore, the process requires a mirror finish rather than a stress relief normal polished surface. To comply with this technical requirement, Rokko is capable of providing mirror polished products that precisely meet customer’s standards through well-developed mirroring technologies.

Rokko has its strength in providing an integrated processing service.

(Grinding → Polishing → RCA cleaning)

■ Tools and Equipment

Visual inspection   Fully automated grinding machine

Visual inspection
Wafers are inspected at receiving, after taping and polishing.

Fully automated grinding machine
Grinds wafers of 4 to 8” diameter precisely without influencing its flatness.
Single-wafer system polishing machine   Wafer mounting

Single-wafer system polishing machine
Wafers are polished according to customer’s thickness requirements.

Wafer mounting
Wafers are mounted on a ceramic plate.
Batch system polishing machine   Wafer demounting

Batch system polishing machine
Polishes 4 to 8” wafers for mirroring.

Wafer demounting
Wafers are demounted from a plate after polishing.
RCA cleaning   Final inspection

RCA cleaning
Wafers are cleaned to remove particles and metal contaminations after polishing.

Final inspection
Wafers are measured and inspected to comply with customer’s specifications.



▼ Rokko Premium Process

『Meeting customer expectations』
● How do you prevent wafers from being broken or chipped after wafer thing process? These damages are mainly caused by either human handling or equipment conveyance and it dose affects your process yield. How do you want to solve this problem?

『Customer needs』
● How do you remove stains on patterned or filmed wafer’s surface after thinning / polishing process?
● Do you have any wafers that you cannot input into your process because of the cleaning capability of your equipment?

※In the conventional cleaning process of polished back surfaces, organic or DI wafer based techniques are used to clean particles. In order to remove metal contaminations from the surfaces, it requires RCA cleaning but this method cannot be used because normally RCA cleaning will etches and damages surface of patterns or films.

To meet such customer needs in the semiconductor backend process, Rokko has developed “Rokko Premium Process” through the collaboration with equipment manufacturers.


 Process

 

Conventional

process
Protective taping
Backside grinding
Single wafer

Backside polishing
Processed surface

contactless tape

peeling


→
Rokko Premium

process
Protective taping
Knife edge

preventive process
Backside grinding
Single wafer

Backside polishing
Processed surface

contactless tape

peeling
RCA cleaning

process for

patterned wafer

 Knife Edge preventive process

『Customer needs』
● How do you prevent wafers from being broken or chipped after wafer thing process? These damages are mainly caused by either human handling or equipment conveyance and it dose affects your process yield. How do you want to solve this problem?

Rokko provides pre-grinding beveling services meeting the diversified requirements of finished thickness (ex. 100 um or 50um).

Through the NC control beveling, Rokko is capable of processing wafers with various thickness without changing polishing pads.

Before BG
Beveling
After BG
Knife Edge preventive process Knife Edge preventive process
Knife Edge preventive process
※Non-beveling process ※Forming a knife edged shape
Knife Edge preventive process Knife Edge preventive process Knife Edge preventive process
※Beveling process ※Beveling compatible with various wafer thickness to form a proper edge profile

Crick here for the video clip showing a dropping test result of 6 inch wafers “with” and “without beveling” →
YOUTUBE
● Knife edge preventing process unit

Knife edge preventing process unit
Wafer size: 4, 5, 6, 8 Inch
● Knife edge preventing process unit

Knife edge preventing process unit
Through NC control system, shapes of edge can be adjusted according to its thickness.
↓
 Back Grinding

Rokko has over 10 years of experiences in the wafer thinning business with various types of wafers from SOI・glass/Si mounted to normal mass production wafers (100-150um thickness).
We are making our continuous efforts to improve the yields of wafers received from our customers.
MEMS applications: SOI・glass/Si mounted, through-holed, cavity structured, through-silicon via (TSV) and non-circular wafers
● Backside Grinder

backside grinder
Wafer Size: 4, 5, 6, 8 Inch
● Backside Grinder

backside grinder
Achieving higher yields through daily maintenance checks.

New Functions:
In the conventional process, wafer thickness is measured by an in-process gauge. Rokko has just installed the machine equipped with NCG (non-contact type gauge) which allows the machine to measure wafer thickness by laser without touching. In the newly developed process, all wafers including MEMS such as cavity structured, holed wafers can be measured.

NCG (non-contact type gauge)
■Wafer Size:5・6・8inch
■Thickness: 100~150μm
■MEMS Wafer process

Rokko is well experienced in processing various kinds of wafers such as SOI・glass/Si mounted, through-holed, cavity structured, through-silicon via (TSV) and non-circular wafers.


↓
 Single wafer backside polishing

In this process, wafers are mirror-polished by removing small roughness on a wafer surface. This process requires highly sophisticated polishing techniques to avoid any distortions or scratches on wafer surfaces.

■Merits of Single wafer process:
●It is a wax-less process that allows to achieve higher cleanness levels by reducing cleaning requirements.
●A single wafer process equipment can polish wafers more efficiently than the batch type and it also requires less removals in comparison.
●A single wafer process provides more accurate polishing and it also helps to achieve higher flatness levels.
● Single wafer backside polishing equipment

Single wafer type backside polishing
Wafer Size: 4, 5, 6, 8 Inch
● Single wafer backside polishing equipment

Single wafer type backside polishing
This machine is capable of processing thinned wafers and MEMS wafers.

New equipment:8 inch single wafer polishing machine
■Wafer Size:4・5・6・8inch
■Best thinning achievement:8inch 85μm
● Backside polishing equipment for 8-inch

Backside polishing equipment for 8-inch
Wafer Size:4・5・6・8inch
● Backside polishing equipment for 8-inch

Backside polishing equipment for 8-inch
Best thinning achievement:8inch 85μm
↓
 Automatic scrub cleaning process

New Equipment:
After polishing, residues contain alkaline substances results in becoming polishing marks or sources of particle. Removing such residues before coated by native oxide films is one of the key techniques in polishing.
In our conventional process, wafers are cleaned piece by piece through operator’s manual scrubbing. Now, Rokko introduced the automated cleaning equipment to eliminate human errors and deviation of quality to achieve the uniform stable quality.

■Wafer Size:4・5・6・8 inch
■Thickness: ~ 100μm
■Patterned・ MEMS and SOI Wafer
Glass supported wafers also can be processed.
● Automatic scrub cleaning process

Automatic scrub cleaning process
High cleaning performance.
● Automatic scrub cleaning process

Automatic scrub cleaning process
Wafer Size:4・5・6・8 inch
Sapphire and SiC wafers can be processed
 Processed surface contactless tape peeling

Protective tapes are peeled off from wafers without touching processed surfaces.
■Wafer Size: 5, 6 Inch
■Tape Type:UV tapes
■Characteristics:
●By Bernoulli chucking robotic arms, wafers are conveyed without being touched.
●After wafers are set on the stage for UV irradiation process, through this procedure, protective tapes on wafers are removed automatically.
● Processed surface contactless tape peeling unit

Processed surface contactless tape peeling process
Wafer Size: 5, 6 Inch
● Processed surface contactless tape peeling unit

Processed surface contactless tape peeling process
Post-polishing surfaces are very fragile. Micro-scratches can be caused easily if the surface is touched by any metallic equipment parts. This unit is capable of removing tapes without touching wafer surfaces.
↓
 RCA cleaning process for patterned wafers

■Available services
・RCA cleaning for wafers with metallic patterns (particle and metal contamination cleaning)
・RCA cleaning for filmed wafers (particle and metal contaminations cleaning)
・Wafer backside RCA cleaning for handle wafers or bonded wafers. (particle and metal contamination cleaning)

■Basic specifications
・Polished surface contactless automated conveyance (cassettes to cassettes) ・Simultaneous double chambered spinning method (RCA cleaning ⇒DIW rinsing⇒Drying)
・Cleaning metal contaminations by only one chemical treatment.
・4, 5, 6 and 8 inches can be processed with minimum thickness of 150um. (The process for under 150um is under development.)
・Handle wafers can be processed in Rokko.

■Cleanness (Patterned wafer backside)
Particles: ≧0.3um,≦50pcs/wf
Heavy metals:≦5.0E10atoms/㎝-2
(Ka,Ca,Ti,Cr,Mn,Fe,Co,Ni,Cu,Zn,Al,Na)


Click here for a demonstration of wafer backside RCA cleaning of patterned wafers→
YOUTUBE
● RCA cleaning process for patterned wafers

RCA cleaning process for patterned wafers
Wafer Size: 4, 5, 6, 8 Inch
● RCA cleaning process for patterned wafers

RCA cleaning process for patterned wafers
This equipment is capable of cleaning only onside (backside) without causing any damages on the other side.




▼ Grinding Technolgy

Grinding and polishing are the core technologies that decide the quality and the characteristics of semiconductors. Rokko is continuously developing its process by adopting new technologies created by consecutive improvements. Because of this effort, Rokko takes a very important role in the fields of MEMS special wafer grinding and polishing processes and its highly established technologies enable the company to fulfill customer’s requests derived from various phases such as R&D or volume productions.

■ Processing Technolgy

Processing Technolgy Precise grinding is the very important factor for eliminating thickness deviations. In this process, the right type of machine that meets customer’s requirements is carefully selected among the variety of process equipment. Rokko’s grinding technologies are able to guarantee the minimum thickness of 15um in prototyping and 100 to 150um in volume productions.

■ Polishing Technology
Polishing Technology After grinding, small roughness is created on wafer surface. In this process, wafers are carefully polished to remove the roughness. The polishing needs to be done in precise and speedy manners to avoid any distortions and scratches on wafer surface.

■ MEMS Technology
MEMS Technology Rokkos’s technologies enable the company to provide integrated grinding and polishing services for MEMS (Micro Electronics Mechanical System) processed wafers such as SOI・glass/Si mounted, through-holed, cavity structured, through-silicon via (TSV) and non-circular.




▼ Monitor wafer reclaiming




Monitor wafer reclaiming

This is recycling services enables monitor wafers used in the semiconductor process to be used again by refining their conditions to the original quality.
Through the services, monitor wafers can be used repeatedly to reduce material costs.
Wafer size:
3 inch
4 inch
5 inch
6 inch
Film stripping
reclaim
Selected recipe
reclaim  
Incoming inspection
reclaim
Polishing

Classify thickness and film type
 
 
reclaim
Shipping
reclaim
Final inspection
reclaim
Cleaning
 
Particle,Metal contamination,Thickness
 
RCA cleaning



New equipment:Wafer sorter for resistivity・P/N・thickness
● Wafer sorter for resistivity・P/N・thickness

Wafer sorter for resistivity・P/N・thickness
For 4,5,6,8 inch
● Wafer sorter for resistivity・P/N・thickness

Wafer sorter for resistivity・P/N・thickness
Measurable resistivity:1.0m~3.0MΩ・cm


■ Tools and Equipment
Film sorting   Film stripping

Film sorting
Wafers are sorted by different types of films by well experienced operators.

Film stripping
Films on wafers are removed by the selected chemicals.
Thickness sorting
  Wafer mounting

Thickness sorting
Wafers are sorted by thickness after film stripping.

Wafer mounting
Wafers are mounted on a ceramic plate for polishing.
Batch system polishing machine
  Wafer demounting

Batch system polishing machine
Multiple wafers are polished concurrently.

Wafer demounting
Wafers are demounted from a ceramic plate after polishing.
RCA cleaning   Particle counter

RCA cleaning
Wafers are cleaned to remove metal contaminations and particles.

Particle counter
This tool inspects particles on polished wafer surfaces.
Final inspection   Total reflection x-ray fluorescence analysis tool TREX610

Final inspection
Wafers are inspected to comply with customer’s specifications.

Total reflection x-ray fluorescence analysis too
Measurable elements: 12 elements (S, Cl, K, Ca, Ti, Cr,Mn,Fe,Co,Ni,Cu,Zn)



New factory opened exclusive
for new material wafer processing

2017/01~

~New materials:SiC,Sapphie,LT,etc~


●Increased processing capacity to cope with mass-production.

●Separated from silicon wafer processing, wafer incoming~
delivery to be one-pass process.

●Cost advantage by the process reduction.

●Mass production started in March, 2017.


■ New factory image
New factory

※New factory(D building) overview
Sapphie 3F Cleaning/Outgoing Inspection
 
3F Cleaning/Outgoing Inspection
Sapphie 2F Polishing room
 
2F Polishing room
Sapphie 1F Grinding
 
1F Grinding

Strength of new factory

 

Sapphie High quality achievement of "Flatness", "Surface roughness", "Work-affected layer" by use of high-rigidity grinder
⇒Reduction of process cost.
     
Sapphie   Reduction of sleigh after back-grind thinning.
⇒Capable of one-pass processing of grinding + polishing.
     
Sapphie   High level cleanness by introduction of exclusive cleaning equipment for Sapphire
(Reduction of contamination + particle)
     
Sapphie   Expect to introduce knife-edge prevention process for Sapphire, which is already under operation for silicon.

Thinning process of patterned SiC wafer

 

Example of patterned SiC wafer processing
Result of thickness variations of grinded wafer (SiC 6-inch wafer)

Unit:umResult of thickness variations of grinded wafer
※TV5: 1um≧ after grinding

 

Result of roughness comparison after grinding (SiC 6-inch wafer)

 

Result of roughness comparison after grindin Thickness variations/surface roughness improved by use of High rigidity grinder..

※Surface roughness improved with conventional grinder.

事業案内 ■ Sapphire processing services事業案内

Rokko provides an integrated sapphire wafer processing service (Grinding → Polishing → RCA cleaning) through the well-developed technologies.
Rokko has developed techniques to utilize its existing semiconductor tools and equipment for sapphire wafer operations. In comparison of the conventional equipment available in the sapphire industry, Rokko’s process has its advantages in throughput, wafer warpage, roughness, and flexibility of wafer size.



Sapphie


Sapphie
● Total reflection x-ray fluorescence analysis tool TREX610

TREX610
Measurable elements: 12 elements (S, Cl, K, Ca, Ti, Cr,Mn,Fe,Co,Ni,Cu,Zn)
● Candela CS20 Wafer surface inspection machine

candela CS20
Wafer Size: 3, 4, 5, and 6 Inch
Measurable thickness: 300-1400um
 Automatic scrub cleaning process

New Equipment:
After polishing, residues contain alkaline substances results in becoming polishing marks or sources of particle. Removing such residues before coated by native oxide films is one of the key techniques in polishing.
In our conventional process, wafers are cleaned piece by piece through operator’s manual scrubbing. Now, Rokko introduced the automated cleaning equipment to eliminate human errors and deviation of quality to achieve the uniform stable quality.

■Wafer Size:4・5・6・8 inch
■Thicknesss: ~ 100μm
■Patterned・ M EMS and SOIWafer
Glass supported wafers also can be processed.
● Automatic scrub cleaning machine
Automatic scrub cleaning process
High cleaning performance.
● Automatic scrub cleaning machine
Automatic scrub cleaning process
Wafer Size:4・5・6・8 inch
Sapphire and SiC wafers can be processed


Sapphire wafer process

Comparison of Sapphire wafer process


  Conventional process Rokko's process
  Diamond lapping Polishing, CMP Grinding Polishing, CMP
Running cost High
(Metal wheels + Diamonds)
Moderate
(Pads + Slurry)
Moderate
(Diamond wheels)
Moderate
(Pads + slurry)
Required level of process technology High Moderate High High
Cost of equipment High Moderate High High
Throughput Very low Low Moderate Moderate
Remarks Wax mounting
Difficulties in lapping table adjustment
Higher number of process is required.
Wax mounting
Difficulties in lapping table adjustment
Vacuum chucking system.
Automatic grinding machine for sapphire and .SiC
Waxless polishing
  Sapphire wafer post cleaning particle measurement result
150mm  Sapphire wafer post cleaning particle measurement result
Pre cleaningcleaning particle measurement result
Sapphire
Scrb cleaningcleaning particle measurement result
Sapphire
RCA cleaningcleaning particle measurement result
Pre cleaning   Scrb cleaning   RCA cleaning
1.Scrub cleaning is effective for removing large size particle
2Particles and dirt are removed after RCA cleaning
3.10 pieces≧0.3um
  Metal contamination after Sapphire wafer cleaning
150mm  Sapphire wafer metal contamination after wafer cleaning
TXRF tester
TXRF tester
TXRF tester
Result of measuring(by TRFX) Sapphire wafer cleaning process

<5X1010atoms/cm2
  TXRF tester




▼ Sensor Devices

In the sensor device process, firstly,electric circuits (patterns) are formed on wafer front surface. Secondly, backside of wafer is grinded for thinning. Wafer with device patterns are very valuable to customers and they need to be handled with care. Rokko’s process is able to treat wafers without damaging patterns with severely selected protection tapes. Similar to the power device grinding services, a special grinding wheel that stimulates growth of a gettering layer on processing surface is also available.
Rokko’s strength lies in the well-developed sensor device process technologies that enable the company to provide integrated grinding and polishing services.


■ Tools and Equipment
Wafer protection tape applicator

  Fully automated grinding machine

Wafer protection tape applicator
After incoming inspection, pressure sensor or UV tapes are applied on wafers. Taped wafers are inspected of adhered dusts during this process.

Fully automated grinding machine
Capable of polishing wafers of 4 to 8 inch without influencing flatness characteristics.
Visual inspection
  Single wafer system polishing machine

Visual inpsection
Wafer appearance is checked in this process.

Single wafer system polishing machine
Polishes wafers to meet customer’s thickness specification.
Non-contact type processing surface tape remover   Ultrasonic cleaning tool

Non-contact type processing surface tape remove
Remove tapes without contacting processed surface.

Ultrasonic cleaning tool
Cleans wafers by ultrasonic after removal of tapes.
    Final inspection



Final inspection
Wafers are inspected based on customer’s visual inspection criteria.

● Automatic spectral interference wafer thickness meter

Automatic spectral interference wafer thickness meter
Thickness can be measured for the silicon layer only of the taped wafer・SOI・supported wafer・resin-material/tape supported wafer(in case 2 silicon wafers are attached, one side silicon layer can be measured).
● Automatic spectral interference wafer thickness meter

Automatic spectral interference wafer thickness meter
Thickness can be measured for supporting silicon layer only or active layer only, other than the total thickness measurement of wafer, for the thinned MEMS/Sensor wafer.


▼ Prejudice to reliability


The below graphs show Rokko’s quality performance.
Rokko focuses on cultivating customer’s trust through the actual process data exhibition of its contracted process services


Back grinding (Processed Qty and Yield)

↓Click to enlarge image

Back grinding


Back grinded products (Thickness based yield)

↓Click to enlarge image
Back grinded products


Back grinded + Polished products (Processed Qty and Yield)

↓Click to enlarge image
Back grinded + Polished products


Back grinded + Polished products (Thickness based yield)

↓Click to enlarge image
Back grinded + Polished products




New factory opened exclusive
for new material wafer processing

2017/01~

~New materials:SiC,Sapphire,LT,etc~


●Increased processing capacity to cope with mass-production.

●Separated from silicon wafer processing, wafer incoming~
delivery to be one-pass process.

●Cost advantage by the process reduction.

●Mass production started in March, 2017.


■ 
New factory image
New factory

※New factory(D building) overview
SiC 3F Cleaning/Outgoing Inspection
 
3F Cleaning/Outgoing Inspection
SiC 2F Polishing room
 
2F Polishing room
SiC 1F Grinding
 
1F Grinding

Strength of new factory

 

SiC High quality achievement of "Flatness", "Surface roughness", "Work-affected layer" by use of high-rigidity grinder
⇒Reduction of process cost.
     
SiC   Reduction of sleigh after back-grind thinning.
⇒Capable of one-pass processing of grinding + polishing.
     
SiC   High level cleanness by introduction of exclusive cleaning equipment for Siapphire
(Reduction of contamination + particle)
     
SiC   Expect to introduce knife-edge prevention process for Sapphire, which is already under operation for silicon.

Thinning process of patterned SiC wafer

 

Example of patterned SiC wafer processing
Result of thickness variations of grinded wafer (SiC 6-inch wafer)

Unit:um TV5grinded wafer
※TV5: 1um≧ after grinding

 

Result of roughness comparison after grinding (SiC 6-inch wafer)

 

Result of roughness comparison after grinding Thickness variations/surface roughness improved by use of High rigidity grinder.

※Surface roughness improved with conventional grinder.

事業案内

Ultra-Thin SiC wafer processing

Sample data of SiC wafers processed with wafer support.
4” SiC wafer used to achieve ultra-thin & ultra-flat.
※Result of thickness variations of grinded wafe (SiC 4-inch wafer)

Backggrinding
4 inch SiC
TV5 (um)
Range
A
B
C
D
E
22.88
22.4
22.03
22.75
22.31
0.37
TV5
4” SiC wafer used to achieve ultra-thin & ultra-flat.
事業案内
■ SiC wafer grinding and polishing services

事業案内

Rokko is one of the few companies that provides an integrated SiC wafer processing service (Wafer grinding, polishing and RCA cleaning) through its soley develped technologies.

Rokko has developed techniques to utilize its existing semiconductor tools and equipment for SiC operations. In comparison of the conventional equipment available in the SiC industry, Rokko’s process has its advantages in throughput, wafer warpage, roughness, and flexibility of wafer size.


SiC
SiC
● Total reflection x-ray fluorescence analysis tool TREX610
TREX610
Measurable elements: 12 elements (S, Cl, K, Ca, Ti, Cr,Mn,Fe,Co,Ni,Cu,Zn)
● Candela CS20 Wafer surface inspection machine
candela CS20
Wafer Size: 3, 4, 5, and 6 Inch
Measurable thickness: 300-1400um
 Automatic scrub cleaning process

New equipment:
After polishing, residues contain alkaline substances results in becoming polishing marks or sources of particle. Removing such residues before coated by native oxide films is one of the key techniques in polishing.
In our conventional process, wafers are cleaned piece by piece through operator’s manual scrubbing. Now, Rokko introduced the automated cleaning equipment to eliminate human errors and deviation of quality to achieve the uniform stable quality.

■Wafer Size:4, 5, 6, 8 inch
■Thickness:~ 100μm
■Patterned・ MEMS and SOI Wafer
Glass supported wafers also can be processed.
● Automatic scrub cleaning machine
Automatic scrub cleaning machine
High cleaning performance.
● Automatic scrub cleaning machine
Automatic scrub cleaning machine
Wafer Size: 4, 5, 6, 8 Inch
Sapphire and SiC wafers can be processed

  SiC wafer process

Comparison of SiC wafer process


  Conventional process Rokko's process
  Diamond lapping Polishing, CMP Grinding Polishing, CMP
Running cost High
(Metal wheels + Diamonds)
Moderate
(Pads + Slurry)
Moderate
(Diamond wheels)
Moderate
(Pads + slurry)
Required level of process technology High Moderate High High
Cost of equipment High Moderate High High
Throughput Very low Low Moderate Moderate
Remarks Wax mounting
Difficulties in lapping table adjustment
Higher number of process is required.
Wax mounting
Difficulties in lapping table adjustment
Vacuum chucking system.
Automatic grinding machine for sapphire and .SiC
Waxless polishing
  SiC wafer grinding process-Roughness
150mm SiC wafer grinding surface roughness
SiC wafer grinding process-Roughness SiC wafer grinding process-Roughness

Evaluation Rough grinding Final grinding
Roughness Ra 12.4-14.6nm 2-5nm
Warp Visual(Scale) 0.5-0.8mm 0.2-0.4mm
※Surface roughness:Non-contact type surface profile measuring equipment :Zygo
  SiC wafer CMP surface AFM measuring result 
(6 inch)
6 inch SiC surface polishing surface AFM measurement result 
(3 points of surface)
AFM measuring result 
Center
Ra:0.711Å
Middle
Ra:0.576Å
Edge
Ra:0.632Å
150mm SiC wafer Si surface post CMP surface roughness Ra < 0.1nm
  SiC wafer post cleaning particle measurement result
150mm  SiC wafer post cleaning particle measurement result
Pre cleaningcleaning paticle measurement result
SiC
Scrub cleaningcleaning paticle measurement result
SiC
RCA cleaningcleaning paticle measurement result
Pre cleaning   Scrb cleaning   RCA cleaning
1.Scrub cleaning is effective for emoving large size particle
2Particles and dirt are removed after RCA cleaning
3.10 pieces≧0.3um
  Metal contamination after SiC wafer cleaning
150mm  SiC wafer metal contamination after wafer cleaning
TXRF tester
TXRF tester
TXRF tester
Result of measuring(by TRFX) SiC wafer cleaning process

<5X1010atoms/cm2
  TXRF tester



▼ Specialized Grinder for Sapphire and SiC

Current trends in the sapphire and SiC wafer industries, the dimeter of wafer becomes larger and larger. Because of this trends, Rokko sees the limitations of the conventional process equipment. Therefore, Rokko has introduced fixed-abrasive-grain type equipment to their sapphire and SiC grinding services.
This newly introduced service is now available for customer evaluations.
 Rokko's philosophy of sapphire and SiC wafer process

●Rokko is capable of providing process services at the same control level of the semiconductor industry that is cultivated through long term relationships with our customers. (DIW, clean room control, work standards for equipment control/operator education/operator certification)
●A wax-less process is established for not only prime wafers but also for wafers with devices. Because cleanness is very critical in the wafer thinning business.
●The integrated process services are available. Thinning work → Mirroring・Stress relief (Polishing) → Processed surface cleaning (contamination・particle removals) (RCA cleaning) and Beveling
●In caparison with the conventional process methods, Rokko’s services is proved to be better in process time and costs.

  Conventional process Rokko's process
  Diamond lapping Diamond lapping Polishing, CMP Grinding Polishing, CMP
Running cost High
(Metal wheels + Diamonds)
High
(Metal wheels + Diamonds)
Moderate
(Pads + Slurry)
Moderate
(Diamond wheels)
Moderate
(Pads + slurry)
Required level of process technology High High Moderate High High
Cost of equipment High High Moderate High High
Throughput Very low Very low Low Moderate Moderate
Remarks Wax mounting
Difficulties in lapping table adjustment
Higher number of process is required.
Wax mounting
Difficulties in lapping table adjustment
Higher number of process is required.
Wax mounting
Difficulties in lapping table adjustment
Vacuum chucking system.
Automatic grinding machine for sapphire and .SiC
Waxless polishing


 New equipment:
● Diamond lapping equipment

Diamond lapping equipment
For 3,4,5,6 inch.
● Diamond lapping equipment

Diamond lapping equipment
Film stripping for SiC wafer reclaim.
Specialized Grinder for Sapphire and SiC

  Specialized Grinder for Sapphire and SiC

Specialized Grinder for Sapphire and SiC
This equipment is made for 6 inch hard-substrate wafers such as sapphire and SiC.

Specialized Grinder for Sapphire and SiC
Automated process via NC control system

Specialized Grinder for Sapphire and SiC
  Specialized Grinder for Sapphire and SiC

Specialized Grinder for Sapphire and SiC
This machine is equipped with an automated wafer conveyance system to perform fully automated wafer processing.

Specialized Grinder for Sapphire and SiC
Equipped with a vacuum checking system (Wax-less)
6 inch Sapphire wafer
  6 inch Sapphire wafer

6 inch Sapphire wafer
Both patterned and prime wafers can be processed.

6 inch Sapphire wafer
SiC wafers are processed by the special grinding wheel.
6 inch SiC wafe
  6 inch SiC wafe

6 inch SiC wafe
Both patterned and prime wafers can be processed.

6 inch SiC wafe
SiC wafers are processed by the special grinding wheel.


▼ President’s messag

PresidentFirst of all, I would like to express my gratitude to all those who have been supporting us over the past years. Our roots began in 1921 when the founder, Katsujiro Kobayashi started research on flat polishing technologies at a Japanese naval arsenal. Later, Kobayashi established a company that manufactures special optical measurement units, “Rex Optical Research Center”. In the year of 1963, known as the year of the birth of the Japanese semiconductor industry, the company was renamed to “Rex Optical Measurement Unit Manufacturing Company” and started polishing and processing services in the semiconductor industry. In 1983 when the office was moved to Fukuoka, a new company “Rokko Denshi” was established to take over the semiconductor operations from “Rex”.

Because of the recent movement that semiconductor technologies are widely spread in our daily lives and become a driving force that accelerates development of the information technology, Rokko decided to focus on silicon wafer processing operations which includes prime wafer mirroring, double side polishing and backside grinding services. Additionally, wafer reclaiming operations are launched in 1994. Rokko expanded the business by adopting the state of the art equipment such as large scale polishers, grinders, lappers and the variety of measurement tools in order to supply the combined services of grinding, polishing and etching required for the silicon material process. After all these years, Rokko’s effort is still set on the company’s policy of “Making better products faster, cheaper, and safer” and the company will continue to improve its quality of services and technologies through creativity and innovativeness to become a better company that is trusted, expected by the society. Every Rokko’s employees will continue to strive to achieve this goal.



▼ Mission Statement

- To provide a thoughtful service that exceeds customer’s expectations.

- To grow and improve through customer satisfaction and open up a new market to find new customers.

- Through the above success, to seek greater happiness for all employees and their families.



▼ Corporate profile
Name Rokko electronics Co., Ltd.
Location Zipp:663-8105 8-5, Nakajima-cho, Nishinomiya-city, Hyogo, Japan
TEL
FAX
81-798-65-4508
81-798-67-5038
Establishment September, 1983
Capital USD375,000
Board President Hidemori Kobayashi
Related Company
Rex Optical Meter works Ltd.
Business Silicon wafer processing
Reclaiming
Polishing
Grinding
MEMS compatible super thinning polishing special processing Etching
Rex Optical Meter works Ltd.


▼ History
March, 1921 The founder, Katsujiro Kobayashi started research on flat polishing technologies with German engineers at a Japanese naval arsenal. Later, he moved to the company “Japanese Optical Industries” (Former Nikon) and worked in the polishing field.
July, 1932
Rex Optical Meter works Ltd. Established “Kobayashi Optical” in Tokyo.

Started sales activities for optical measuring units and special processing services.

March, 1947 After WWII, the company was moved to Nishimiyashi, Hyogoken and renamed to “Rex Optical Research Center” as a special optical measurement unit manufacturer.
April. 1960 Started semiconductor polishing services.
June. 1963
Reorganized and renamed “Rex Optical Measurement Unit Manufacturing Company”. Focused on wafer polishing business. Rex Optical Meter works Ltd.
September. 1983 Rokko Denshi was established to take over the semiconductor operations. Rex was relocated in the site of Mitsubishi Electric (Fukuoka).
July. 1994 Fab B was built to develop reclaim wafer operations. Large scale polishers and RCA cleaning equipment were installed.
May. 2001 Obtained ISO 14001 certification
February. 2005 MEMS compatible thin wafer polisher was installed.
March. 2005 Obtained ISO 9001-2000 certification
November, 2012 Awarded as the outstanding performance company,by Nishinomiya-city
January, 2017 Mr. Hidemori Kobayashi appointed as President
January, 2017 New factory started operation for new material wafers: SiC, Sapphire, LT, etc.
February. 2018 Obtained ISO 9001-2015 and 14001-2015 certification

▼ Method of access


■ Access

acess map

●10 minute walk along the railroad track from JR Koshienguchi Station.
●15 minute walk to the southeast direction from Hankyu Nishinomiya Kitaguchi Station.
▼ 2020 calendar of Rokko Electronics Co., Ltd.
■ Click the calendar below to open a PDF for printing.



▼ Safety activities

There are always risks of accidents or disasters in a manufacturing plant. Rokko realizes its responsibility to ensure safety of employees not only during work hours but also time of commuting. To fulfill such responsibility, the company organizes a safety and health committee and holds a meeting on a monthly basis. In this meeting, safety issues brought up by the divisions of the company are reviewed to make a “risk assessment chart”. Safety issues are prioritized in the chart to take measures and monitor its progress by “PDCA” techniques. Also periodically, safety and health supervisors patrol the factory to check its working environment for continuous improvements.

In September, 2011, Rokko published the business continuity plans to comply with the guidelines of the Small and Medium Enterprises Agency’s “BCP (Business Continuity Plan)” and reviews and updates the continuity plans through safety and health committee meetings.

Safety and Health Committee   Risk Assessment

Safety and Health Committe
A meeting is held on a monthly basis to review safety and health related issues.

Risk Assessment
Potential risks in the company are reviewed and prioritized to take measures.
In process patrols   Continuous process safety improvements

In process patrols
Supervisors patrol to assess potential risks in process.

Continuous process safety improvements
Observations found through process patrols are listed for continuous improvements and measures.
Certified employees
  BCP

Certified employees
Safety management supervisor : 2 persons
Class 1 health supervisor:4 persons

BCP
In September, 2011, Rokko published the business continuity plans to comply the guidelines of the Small and Medium Enterprises Agency’s “BCP (Business Continuity Plan)”.
Emergency contact networks
  Emergency contact networks

Emergency contact newworks
Emergency communication flows are clearly visualized for its employees in case of emergency.

Emergency contact newworks
In all processes, emergency contact networks are posted.
Evacuation routes
  Eye washers

Evacuation routes
Evacuation routes are visually available for all employees and drills are conducted according to the routes.

Eye washers
It is a mandatory to wear an eye covering during operation. In case of eye injury, eye washers are installed in process.
Medical networks   Emergency calls

Medical networks
Hospitals are listed in case of emergency.

Emergency calls
“How to make emergency calls” is posted to help a person to make an emergency call in a proper manner.
Electric power failure evacuation drills
  Electric power failure evacuation drills

Electric power failure evacuation drills
Drills are carried out periodically to train its employees and ensure quick evacuation in case of emergency.

Electric power failure evacuation drills
Firstly, operators take shut down sequence of process equipment and secondary, a group leader escort operators for evacuation.
Electric power failure evacuation drills   Electric power failure evacuation drills

Electric power failure evacuation drills
All stuff and operators are evacuated to the company’s parking lot.

Electric power failure evacuation drills
Rokko achieved the evacuation time of 7min 46sec against the initial target of 10min.




▼ Quality management activities

Rokko thinks good quality is accomplished through continuous efforts to produce finished products that give customers greater satisfaction and supply its products without delay. Rokko has never forgotten that some of the products that the company processes may become a part of devices that support human lives. So employees of the company perform assigned duties with honors and prides and Rokko will continue to strive for a better quality of services.

ISO9001:2015 Certification
  Standard operation procedures

ISO9001:2015 Certification
Rokko obtained ISO9001 certification in March of 2005. The company implemented the ISO recommended tool, “PDCA” (plan, do, check, and action) to achieve the company’s various objectives.

Standard operation procedures
Rokko has worked on maturing its SOP to synchronize its operator’s work performance.
Process Flow   Certified skill tables

Process Flow
A process flow chart is visually available in processes for operators to minimize human errors.

Certified skill tables
By summarizing certified skills of every operator in a table format, the table helps operators visualize next target skills.
Daily process check books   Measurement tool check sheets

Daily process check books
Machine startup checklists are prepared for equipment activations.

Measurement tool check sheets
Calibrations of every tool are recorded.
Machine based operating cycle time books
  In process cleaning check sheets

Machine based operating cycle time books
All machines are maintained based on cycles of operation.

In process cleaning chek sheets
In-process and machinery cleaning activities are recorded consistently.
PH check tables
  Small group activity meeting minutes

PH check tables
PH calibration of polishing machines is recorded.

Small group activity meeting minutes
Periodical group meetings are held by process operators and meeting minutes are filed.
Filing list   Temperature and humidity recording

Filing list
All records are filed properly.

Temperature and humidity recording
Temperature and humidity are measured and recorded.
Quality management meeting 1   Quality management meeting 2

Quality management meeting 1
A quality management meeting is held on a monthly basis.

Quality management meeting 2
This meeting is voluntary held based on customer’s needs and requirements.




▼ Environmental management activities

Rokko Electronics Co., Ltd. is located at the Nishinomiya city’s semi-industrial district, Nakashima-cho. Rokko has an important role in the semiconductor material processing services. However, on the other hand, the operations consume a large amount of energy, natural resources and chemical substances which results in generating industrial wastes. Realizing these facts, all of Rokko employees will voluntary participate in the environmental activities to sustain the eco-friendly society.

2011 Article, Ninomiya-City’ Environmental Report:

Article, Ninomiya-City’ Environmental Report


Ninomiya-city introduced the Rokko’s “Green curtains” in the city’s published environmental report.

ISO14001 certification
  Qualified personnel list

SO14001 certification
Certified for ISO14001 in May, 2001.

Qualified personnel list
11 persons attended the ISO14001 internal auditor certification seminar.
Nshinomiya city district promotion center for prevention of global warming   Demand supervisory control unit

Nshinomiya city district promotion center for prevention of global warming
Rokko is selected for “Nishinomiya city district promotion center for prevention of global warming”.

Demand supervisory control unit
As per the request of summertime electricity saving from Kansai Electric, Rokko installed the equipment to monitor its electricity usage.
The Green Curtains
  The Green Curtains

The Green Curtains
Cooperating in the electricity saving, Rokko applied the green curtains to its building.

The Green Curtains
The "Green Curtain" serves as a covering of windows by climbing plants such as bitter gourd. It not only prevents room and outside surface temperatures of buildings from rising by blocking the strong summer sunshine, but also helps to cool down room temperature via foliage transpiration.
Bitter gourds
  Bitter gourds

Bitter gourds
Over 500 pcs of bitter gourds are harvested.

Bitter gourds
The harvested bitter gourds are shared among its employees and the neighbors

Certified industrial waste storage area
   

Certified industrial waste storage area
Supervisors are assigned to manage conditions and locations of stored industrial wastes.






▼ Quality・Environment Policies


Under the policy of “Making better products faster, cheaper, and safer”, since early times, Rokko has worked on obtaining ISO 9001(March. 2005), 14001(May. 2001) certifications. The company still makes continuous efforts to improve the systems in the purpose of fulfilling customers sever quality demands as well as contributing to the better environment and welfare of the society.

■ ISO9001:2015 Certification
The Rokko’s quality policy is to make wide contributions to the society through its business prosperity. In order to achieve this goal, all of the company’s operations must serve the society’s welfare and Rokko believes that “Quality・Price・Delivery・Service” are the essences of such contributions and the company will make the best possible effort to pursue all the essences . Especially, as the manufacturer, Rokko puts its highest priority on its quality to provide the products and the services that satisfy customers. Through the products and the services, Rokko will achieve its prosperity and contributions to the society concurrently. Under this policy, all the Rokko employees put their hearts in “Customer’s satisfaction first”
ISO9001:2015 Certification

■ ISO14001:2015 Certification
Rokko’s business operations cover the wide range of semiconductor materials while the semiconductors are closely related to variety of areas of our daily. The company is making a great contribution to our society through the silicon reclaim wafer operations which are the recycling services of used semiconductor materials. However, on the other hand, the operations consume a large amount of energy, natural resources and chemical substances which results in generating industrial wastes. Realizing these facts, all of Rokko employees will voluntary participate in the environmental activities to sustain the eco-friendly society.
ISO14001:2015 Certification



▼ Rokko Electronics Business Continuity Plans

“Rokko Electronics Business Continuity Plans” contains details of contingency measures for business continuity and preparedness activities during normal times designed to enable continuity of our core businesses and early recovery while minimizing damages to our assets in case of emergency, such as natural disaster, large fire, terrorist attacks and pandemic.

Emergency occurs with no prior warning. We think it especially important to be well prepared by maintaining BCP during normal times to prevent our business from downsizing and collapse due to emergency, and consequently causing loss to our customers and other trade partners.

Therefore, in September 2011, we published the Business Continuity Plans to comply with the guidelines of the Small and Medium Enterprises Agency’s “BCP (Business Continuity Plan)” and periodically review and update the Continuity Plans through safety and health committee meetings.

■ Rokko Electronics Co., Ltd. Business Continuity Plans Main Contents

1.Basic Policy :
・Basic policy for BCP
2.BCP operational structure: :
・Development of BCP and its operational structure
3.Core businesses and recovery target: information on core businesses
・Information on alternative source for various resources critical to business continuity
4.Financial diagnoses and planning of contingency measures :
・Calculation of recovery costs and cash on hand
・Investment planning for contingency measures (refer to Regional Hazard Map)
5.Invoking BCP in response to emergency
(1)Invocation flow
(2)Evacuation: evacuation planning sheet
(3)Information sharing: contact information of main organizations [financial institutions]
・List of contact information of employees
・[Basic information sharing] → refer to the list of all employees ・chain of communication in emergency
・Telephone number/FAX number sheet [internal use] 】
・Information related to main customers
→Refer to status list by business connection
(4)Resources
・Bottleneck resources for core businesses
・[Facilities/equipment/vehicles etc.] → refer to the Fixed Asset Ledger
・Information on supplies critical to core businesses
・Information related to main suppliers/vendors [by supplied item] →refer to the Purchase Ledger
・Check list on disaster tools

 
Rokko Electronics  Business Continuity Plans

■ Rokko Electronics Basic Policy for BCP
The purpose of BCP (business continuity plans) and key points for securing business continuity in emergency at Rokko are as follows:
1. Purpose of BCP development and operation: :
①For our customers
To minimize impacts on our customers’ production plans.
②For our employees
To protect safety and employment for our employees including their families.
③For regional community
To contribute to community life and economy.
④Others

2. Key points for securing business continuity in emergency: :
①Rokko will cooperate with neighboring companies in the region to overcome difficulties.
Rokko will cooperate with neighboring companies in the region to overcome difficulties.
②Conscientious business practice
We will make payments due to our suppliers without delay even in emergency.
③Contribution to the community
We will help each other in the community in emergency by, for example, serving hot meals to disaster victims.
④Utilization of public emergency relief system
In emergency, we will make use of the emergency consultation service at the city hall and chamber of commerce.
⑤Others

3. Renewal period for BCP and Emergency Plan: every September (annual update)


■ Rokko Electronics Continuous operation mechanism of BCP cycle

  Development of BCP basic policy Normal times

Implementation of BCP cycle

Update based on newly experienced issues and lessons
①Understanding of the company’s business    
 
⑤Testing, maintenance and update of BCP   ②Discussion on how to prepare BCP and contingency measure
 
④Establish BCP culture
③Creation of BCP
Occurrence of an emergency situation
Recovery from emergency
Invocation of BCP


▼ Rokko Electronics CSR Activities


Based on our mission statement, “To provide a thoughtful service that exceeds customer’s expectations; to grow and improve through customer satisfaction and open up a new market to find new customers; through the above success, to seek greater happiness for all employees and their families,” we will pursue provision of a thoughtful service not only for customer but also for employees, regional community, and society. In doing so, we will seek to grow and improve. This is the philosophy that lies at the heart of our CSR activities.

■ Rokko Electronics CSR Activities Action Policy
1. Compliance
1)Compliance with the laws and regulations
2)Fair competition and trade
3)Prevention of conflict of interests
4)Prohibition of bribery, excessive entertainment, and gifts
5)Prevention of leakage of information (information security)
6)Security export control

2. Respect for human rights

3. Healthy work environment
1)Safe work environment
2)Health considerations
3)Facilitation of employee-friendly work environment

4. Relationship with society
1)Customer satisfaction
2)Contribution to society
3)Protection of environment
4)Firm stand against anti-social individuals and groups


As information technologies develops rapidly, Rokko Denshi Co. Ltd. recognizes the growing social demands concerning the protection of personal information such as company or group name, resident address or email address that can be used to identify individuals. Rokko takes full responsibility to protect such information by the following policies.

1.Personal Information control
Any receiving information that includes name, company name, resident address, telephone numbers or email address from customers are treated as customer personal information (hereinafter called “privacy information”) and the access to such information is limited to only assigned personnel for the proper handling.

2.Purpose and purview of collecting personal information
Rokko will clearly define the purpose for collecting privacy information and properly handle the privacy information to the extent necessary to achieve the original purpose of data collection.

3.Purpose of using privacy information
Due to a nature of Rokko’s business, fulfilling customer’s inquiry may require a service of other Rokko’s related companies or business partners. Rokko may need to transfer privacy information on a need to know basis.

4.Disclose of privacy information
Rokko will not disclose or share any privacy information with third companies inlcuding Rokko’s related companies or business partners without its customer’s consent. (This policy will not applied for law obligations such as court orders.)

5.Compliance with the law and the regulations and continuous improvements
Rokko will strive to continuously improve the management system, security control measures, and other necessary measures to promote greater protection of privacy information.

6.SSL
Rokko protects privacy information during transmission by using Secure Sockets Layer (SSL). SSL protects data transmission from a client to Rokko’s web site by preventing from data tapping or falsification.


▼ Contact Form


Welcome to Rokko’s web sites. Please get in touch with Rokko by completeing this form or call and ask for Egawa / Overseas Sales Dept. Regarding Rokko’s privacy policy, please refer to "Privacy policy".



▼ Application Form


Thank you for visiting Rokko Electronics Co. Ltd. We always welcome any applicants with prospective skills and motivations. If you are interested, please contact us through the below application form. In case of urgent matters, please give us a call (HR:). Please view our privacy policy upon your application.



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