Participated in Semicon
Taiwan 2012 to introduce the newly developed SiC/sapphire
wafer polishing technologies.
August 11th, 2011
●The Rokko’s “Green Curtains”, the bitter gourds were
planted in the middle of May. They have grown very well
and reach the third floor of the building. The green
curtain is an energy saving tool that not only prevents
room and outside surface temperatures of buildings from
rising by blocking the strong summer sunshine, but also
helps to cool down room temperature via foliage transpiration.
As the eco-friendly organization, Rokko gives full cooperation
in energy saving through the green curtains and the
demand supervitory control unit.
July 30th, 2011
July 30th (Sat) 16:00
Power failure evacuation drill was carried out. After
shutting down processing equipment and tools, group
leaders escorted operators to the company’s parking
lot for evacuation. In this drill, Rokko achieved
7 min 46 sec of evacuation time against the target
of 10 min.
July 25th, 2011
Exhibited at “Micro-machine / MEMS Show 2011”, Tokyo
Big Sight
Exhibited items
SiC wafer, 3 inch as grinded・polished
Sapphire wafer, 4 inch as grinded・polished
Soi Wafer polishing
Glass support wafer grinding
Glass support wafer polishing
Cavity structured wafer grinding
Cavity structured wafer polishing
Through-holed wafer grinding
Non-circular wafer grinding
Reclaim wafer
Grinded + Polished wafer
#8000 grinding finished wafer
July 7th, 2011
Exhibited at SIIQ Semiconductor Festival &
Kyushu broadcasting Equipment Exhibition for the first time.
Announced “MEMS wafer special grinding・polishing
& SiC・GaN・Sapphire substrate” at “SEMI FORUM JAPAN 2011”
(SFJ technology introduction seminar that introduced new technologies,
newly developed equipment and tools)
