■ Ultra-thinning and planarization of 4- and 6-inch LT/LN junction substrates and oxide wafers
With the introduction of
new equipment, ultra-thinning and ultra-flattening processing
has become possible!
We have introduced terrace processing, ultra-high precision
grinding machines, CMP, and trimming machines.
We achieved thinning and ultra-flattening at the nm
level.
■Ultra-thinning
and planarization of 4.6-inch LT/LN junction substrate
wafers
Terrace processing ⇒ Grinding ⇒ CMP ⇒ Trimming
Terrace processing
⇒
Grinding
⇒
CMP（flattening）
⇒
Trimming process
⇒
⇒
⇒
■Oxide film ⇒ Ultra-flattening processing
CMP ⇒ Trimming
Surface flatness and roughness data before and after processing
１
２
Before processing
After processing
Even with 4.6-inch
LT/LN bonded substrate wafers, the same level of ultra-thinning
and planarization as described below is possible.
