Because of the recent movement that semiconductor technologies are widely spread in our daily lives and become a driving force that accelerates development of the information technology, Rokko decided to focus on silicon wafer processing operations which includes prime wafer mirroring, double side polishing and backside grinding services. Additionally, wafer reclaiming operations are launched in 1994. Rokko expanded the business by adopting the state of the art equipment such as large scale polishers, grinders, lappers and the variety of measurement tools in order to supply the combined services of grinding, polishing and etching required for the silicon material process. After all these years, Rokko’s effort is still set on the company’s policy of “Making better products faster, cheaper, and safer” and the company will continue to improve its quality of services and technologies through creativity and innovativeness to become a better company that is trusted, expected by the society. Every Rokko’s employees will continue to strive to achieve this goal.