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Please contact ROKKO at
Attention: Overseas Sales Dept.
TEL: 81-798-65-4508
FAX: 81-798-67-5038
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Job Opportunities
Please click below
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ROKKO ELECTRONICS Co., Ltd.
Zipp: 663-8105
8-5, Nakajima-cho, Nishinomiya-city, Hyogo, Japan
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| ■ Tape bonding |
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■Examples of thinning processes using tape bonding：
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| ■8-inch thinned silicon 4.5um |
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TV5 (um)
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A
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B
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C
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D
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E
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Range
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4.2
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4.6
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4.4
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2.2
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3.9
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2.4
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| ■4-inch SiC thinned 5.5um |
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TV5 (um)
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A
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B
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C
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D
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E
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Range
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6.1
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5.9
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5.4
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5.9
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5.4
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0.7
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| ■ Resin bonding |
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■Resin bonding pasting：
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■Resin bond peeling：
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Resin temporary bonding device
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